Thermaldiffusion equipment

At present, NPO GKMP LLC is the only domestic manufacturer of SDOM type thermal diffusion systems designed for processing semiconductor wafers with a diameter of up to 100 mm. It is possible to manufacture plants for processing plates with a diameter of up to 150 mm; in the future, plants for thermal diffusion of plates with a diameter of 200 mm and 300 mm are being developed.

Depending on customer requirements, in thermal diffusion systems it is possible to realize oxidation processes (including pyrogenic) and diffusion using various oxidizing agents and diffusants (nitrogen, chlorine, arsenic, phosphorus, boron, etc.)

The heating elements used in installations like SD.OM have a unique design and are wound from wire of special grades of high-temperature alloys (Eurofechral, kanthal, kanthal A1). Winding is carried out in a hot state according to a specially developed technological cycle, which significantly reduces the residual deformation of the resulting heater and extends its service life.

The system is designed for automatic group thermal thermal precision processing of silicon wafers with a diameter of 100 mm in the manufacture of semiconductor electronics products.

Features of installations like SD.OM:

• Number of heating chambers: 2 or 3
• Maximum process temperature: 1250 ° C
• Length of the working thermal zone: 600 mm
• Temperature field distribution error: ± 1 ° С
• Temperature reproduction accuracy: ± 1 ° С
• Heating element material: Kanthal or Eurofechral
• Loading and unloading: manual or using built-in loaders
• Modern automated process control system
• Independent operation of each reactor
• Energy-efficient power supply system for heaters
• Accurate system for controlling the flow of oxidizing agents and diffusants